Contact blades: Multiple copper contact fingers (such as T2 copper plates) are arranged around a ring-shaped support bracket, with a thick silver plating on the surface to enhance electrical conductivity and wear resistance.

Support bracket: Non-magnetic stainless steel ring structure to avoid eddy current effects and ensure uniform pressure distribution.

Spring contact fingers: Embedded in the ring-shaped grooves of the support bracket, providing contact pressure through tension springs to increase contact points and improve electrical conductivity.

Self-cleaning effect: The contact surfaces slide relatively during opening and closing operations, which helps remove oxide films and reduce contact resistance.

High electrical stability: The line contact structure is attracted by electromagnetic force under short-circuit current, enhancing contact tightness.

Anti-oxidation treatment: The silver plating undergoes anti-tarnish treatment to prevent silver layer oxidation and peeling.